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tinvoa SAC305 15g solder paste syringe — Sn96.5/Ag3.0/Cu0.5, Type 4 powder, No-Clean ROL0 flux, RoHS-compatible
Solder Paste · Lead-Free

SAC305 Lead-Free Solder Paste

Sn96.5 / Ag3.0 / Cu0.5
217–220°C melt 15g syringe IPC J-STD-005A No-Clean ROL0
Powder Grade
$13.99/ syringe
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  • Tested using IPC J-STD-005A methods · CoC available per lot
  • RoHS-compatible · REACH SVHC declared · halide-free flux
  • Fresh manufacturing date printed on every syringe
  • 6-month shelf life refrigerated (2–10°C)
Technical Specifications

Engineering-grade data for your bench.

Complete specs for SAC305 Type 4 and Type 5 solder paste. Values change automatically when you switch powder grade above.

Typical values are not specifications. Lot-specific data available on request.

Alloy Composition Sn 96.5% (bal.) / Ag 3.0 ±0.2% / Cu 0.5 ±0.1%
Solidus / Liquidus 217°C / 220°C
Alloy Density 7.40 g/cm³
Flux Type No-Clean Rosin · ROL0 (IPC J-STD-004B)
Flux Activity Low activity · halide-free
Halide Content Halide-free — <0.05% by weight in flux solids (IPC-TM-650 2.3.28.1, ion chromatography)
Powder Particle Size (Type 4 selected) 20–38 μm (Type 4)
Metal Content (wt %) 88.5 ± 0.5 % (Type 4)
Viscosity (Malcom PCU-205, 10 rpm, 25°C) 180 ± 30 Pa·s (Type 4)
Tackiness 30–40 gf (4 h after print)
Slump Resistance Pass IPC-TM-650 2.4.35
Package 15 g net · resealable luer-lock syringe
Shelf Life 6 months refrigerated (2–10°C) · ≥ 24 h working time
Compliance RoHS · REACH SVHC declared · Flux ROL0 per IPC J-STD-004B · Paste per IPC J-STD-005A · Alloy per IPC J-STD-006C
Recommended Stencil 4–6 mil (Type 4) · area ratio ≥ 0.66
Ultrasonic-atomized powder by Lingsko · Type 4 typical: sphericity 0.952 · oxygen 100 ppm · 95.2% in-size How the powder is made →
Recommended Reflow Profile

Dial in your reflow curve.

Reference temperature profile for SAC305. Tune within the 235–250°C peak window and 45–90 s TAL to your oven and PCB thermal mass.

250°C 200°C 150°C 100°C 50°C 0°C 0s 60s 120s 180s 240s 300s 217°C solidus · 220°C liquidus PREHEAT SOAK REFLOW COOLING Peak 245°C
1 · Preheat
25 → 150°C
Ramp 1–2 °C/s · ~60–90 s
2 · Soak
150 → 200°C
Dwell 60–120 s · activates flux
3 · Reflow / Peak
235–250°C peak (target 245°C)
Time above 220°C (liquidus): 45–90 s
4 · Cooling
245 → 100°C
Ramp ≤ 4 °C/s · limits thermal shock to components

Profile shown is a reference. Always validate on your own thermal-mass test board. Full reflow parameters in the TDS download below ↓.

Safety & Hazard Information

GHS hazard communication.

Lead-free tin-silver-copper alloy. Classified under OSHA HazCom (29 CFR 1910.1200). Full classification, exposure limits and first aid are in the Safety Data Sheet, available on request.

GHS07
Skin sensitizer
Signal word: WARNING

Hazard statement

  • H317 · May cause an allergic skin reaction.

Classification: Skin sensitization — Category 1. This is the only hazard class assigned to the finished paste. The product carries no aquatic-hazard (GHS09) and no health-hazard (GHS08) classification.

Precautionary statements

  • P261 · Avoid breathing dust or fumes.
  • P272 · Contaminated work clothing must not be allowed out of the workplace.
  • P280 · Wear protective gloves.
  • P302+P352 · IF ON SKIN: Wash with plenty of water.
  • P333+P313 · If skin irritation or rash occurs: Get medical advice or attention.
  • P362+P364 · Take off contaminated clothing and wash it before reuse.
  • P501 · Dispose of contents and container in accordance with applicable local, regional, national and international regulations.

Soldering fume — hazard not otherwise classified

Thermal processing generates rosin-based flux decomposition products and metal-oxide fume. Repeated or prolonged inhalation of rosin-based soldering fume may cause occupational asthma in susceptible people. Use effective source-capture local exhaust ventilation during printing, reflow, hand soldering and rework, and keep the operator's head out of the fume plume. The finished paste itself is not classified for respiratory sensitization.

California Proposition 65: no listed chemical is intentionally added to this lead-free formulation. Full classification in the Safety Data Sheet ↓

Compliance & Documents

Everything your QA team needs.

Datasheets and compliance documents. A Certificate of Conformance (CoC) ships with every wholesale order.

Technical
Technical Data Sheet (TDS)

Physical, chemical, and electrical specifications with reflow profile and stencil-printing parameters. Separate sheet per powder type.

View T4 View T5
Process
Instructions for Use (IFU)

Step-by-step bench guide: opening, warming, stencil printing, dispensing, reflow, and post-reflow inspection.

View T4 View T5
Safety
Safety Data Sheet (SDS)

OSHA/GHS-compliant safety information covering handling, storage, transport, first-aid, and disposal.

Request document
Compliance
RoHS Declaration

Lead-free verification under EU directives 2011/65/EU and 2015/863, .

Request document
Compliance
REACH Compliance Letter

SVHC (Substances of Very High Concern) declaration under EU REACH (EC 1907/2006).

Request document
Quality
Certificate of Conformance (CoC)

Lot-traceable statement of conformance to this product's specification. Issued per lot with wholesale orders.

Request document
FAQ

SAC305 solder paste — questions.

Is SAC305 solder paste good for hand dispensing and rework?

Yes. It comes in a 15 g resealable luer-lock syringe: use 18G–20G tips for standard pads and 22G for denser pads. Reflow in an oven, on a hot plate or with hot air — peak at 235–250°C (target 245°C) with 45–90 s above the 220°C liquidus, then let the joint cool undisturbed.

Should I choose Type 4 or Type 5 SAC305?

Type 4 (20–38 µm) covers standard pads and apertures down to roughly 0.4–0.5 mm pitch, with a 4–6 mil stencil. Type 5 (15–25 µm) is for 0201/01005 passives, fine-pitch QFN/BGA and pitches down to roughly 0.3 mm. If your pads don't need Type 5, Type 4 is the more economical choice.

Do I need to clean the flux residue after reflow?

No. The flux is a no-clean ROL0 type per IPC J-STD-004B, halide-free (<0.05% by weight in flux solids), and its residue is non-conductive and non-corrosive. If you plan to conformal-coat or want a cosmetic finish, clean with an IPA-based solvent.

How should I store SAC305 solder paste?

Refrigerate at 2–10°C (36–50°F) and don't freeze it. Shelf life is 6 months from the manufacturing date printed on the syringe. Let the sealed syringe warm to room temperature for at least 4 hours before opening; once warm, the paste has at least 24 hours of working time.

Put SAC305 on your bench.
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Single 15 g syringes ship from our U.S. warehouse — $4.99 flat, free on orders of $49.99+ with code FREESHIP. Bulk orders ship with full compliance docs.

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