Most popular
SAC305
Sn96.5 / Ag3.0 / Cu0.5 · Lead-free
- Melting~217–219 °C
- PowderT4 & T5
- Size15 g syringe
- Best forGeneral SMT / lead-free
Value
SAC0307
Sn99.0 / Ag0.3 / Cu0.7 · Lead-free
- Melting~217–227 °C
- PowderT4
- Size30 g · 50 g
- Best forCost-optimized lead-free
Low-temp
Sn42 / Bi58
Bismuth-tin · Low-temperature
- Melting~138 °C
- PowderT4
- Sizes30 g & 50 g
- Best forLED / flex / heat-sensitive
Silver-added
Sn42 / Bi57.6 / Ag0.4
Silver-added bismuth-tin · Low-temperature
- Melting~138 °C
- PowderT4
- Size15 g
- Best forLow-temp joints that flex or cycle
B2B only
Sn63 / Pb37
Leaded eutectic · RoHS-exempt
- Melting183 °C
- PowderT4
- Size30 g · 50 g
- Best forRework / high-reliability
B2B only
Sn62 / Pb36 / Ag2
Leaded · anti-silver-leach
- Melting179 °C
- PowderT4 / T5
- Size30 g · 50 g
- Best forAg / Ag-Pd terminations
No-clean
No-Clean Soldering Flux
Rosin flux paste · ROL0 · No-clean, halide-free
- TypeNo-clean rosin
- ClassIPC J-STD-004B ROL0
- Size10 cc syringe
- Best forTouch-up / rework
High-tack
No-Clean Tacky Flux
High-tack rosin paste · ROL0 · Holds components through reflow
- TypeNo-clean rosin, high-tack
- ClassIPC J-STD-004B ROL0
- Size10 g · 10 cc syringe
- Best forBGA reballing / part hold
Not sure which alloy?
Tell us your process — pad pitch, reflow profile, RoHS status — and we'll recommend the right paste and powder type.