Technical Data Sheet
™
Solder Paste & Precision Soldering
SAC305 LEAD-FREE SOLDER PASTE — TYPE 5
Sn96.5 / Ag3.0 / Cu0.5 · Type 5 Powder (15–25 µm) · Fine-Pitch · SKU TSP-SAC305-T5-15G
Features
- Lead-Free Tin-Silver-Copper Eutectic Alloy (SAC305) — the industry-standard SMT alloy
- Melting Range 217–220°C (423–428°F) · bright, reliable solder joints
- No-Clean · Halide-Free ROL0 Flux per IPC J-STD-004B
- Type 5 Powder (15–25 µm) per IPC J-STD-005A — finer particle size for fine-pitch & micro-pads
- Ideal for 0201 / 01005 chips, fine-pitch QFN/BGA and miniature stencil apertures
Description
Sn96.5/Ag3.0/Cu0.5 (SAC305) is the most widely used lead-free solder alloy for surface-mount assembly. tinvoa SAC305 Type 5 uses a finer powder (15–25 µm) than Type 4, formulated for fine-pitch and high-density assembly — 0201 and 01005 passives, fine-pitch QFN/BGA, miniature pads and small stencil apertures (down to roughly 0.3 mm pitch). It is a no-clean paste with a 217–220°C melting range, suited to precision reflow, micro-stencil printing and rework. High metal loading (≈88.0% metal / 12.0% flux) delivers strong tack and bright joints; the push-scraper syringe design promotes smooth flow with minimal waste.
Type 5 vs Type 4 — Type 5's smaller, more uniform spheres release cleanly through fine apertures and deposit consistent volumes on micro-pads. For standard pad geometries, Type 4 (TSP-SAC305-T4-15G) is the more economical choice; choose Type 5 when feature size or pitch demands it.
Major Alloy Ingredients in Percent
| Sn | Ag | Cu |
|---|
| Sn: 96.5 (bal.) | Ag: 3.0 ± 0.2 | Cu: 0.5 ± 0.1 |
Impurity Levels to IPC J-STD-006C in Percent (max)
| Pb: 0.10 | Bi: 0.10 | Sb: 0.10 | In: 0.10 |
| Al: 0.005 | Au: 0.05 | Fe: 0.02 | Ni: 0.01 |
| As: 0.03 | Cd: 0.002 | Zn: 0.003 | Total others: 0.20 |
Typical Alloy Properties
| Property | Typical Value |
|---|
| Solidus / Liquidus Temperature °C | 217 / 220 |
| Density g/cc | 7.40 |
| Electrical Conductivity % of IACS | 15 |
| Thermal Conductivity W/m·°C | 58 |
| Coefficient of Thermal Expansion PPM/°C | 22 |
| Tensile Strength PSI | 6,500 |
| Elongation % | 35 |
| Brinell Hardness | 15 |
Typical Paste Properties
| Property | Typical Value | Method |
|---|
| Powder type / particle size | Type 5 / 15–25 µm | IPC J-STD-005A |
| Metal content (% by weight) | 88.0 ± 0.5 | J-STD-005A |
| Flux content (% by weight) | ≈ 12.0 | J-STD-005A |
| Viscosity (Pa·s) | 200 ± 30 | Malcom spiral, 10 rpm, 25°C |
| Flux classification | ROL0 (No-Clean) | J-STD-004B |
| Halide content | Halide-free (< 0.05%) | J-STD-004B |
Typical values shown are representative of the alloy/paste class and are not guaranteed specifications — confirm against the lot-specific Certificate of Analysis (CoA).
Performance Tests — IPC J-STD-005A
| Test | Typical Result | Method |
|---|
| Solder ball test | Pass (Preferred) | J-STD-005A / IPC-TM-650 2.4.43 |
| Slump test (after preheat) | Pass — no bridging | IPC-TM-650 2.4.35 |
| Tackiness (gf) | 30–40 | IPC-TM-650 2.4.44 |
| Tack life (open, 25°C) | ≥ 24 h | J-STD-005A |
| Wetting | Pass — full wetting | IPC-TM-650 2.4.45 |
| Copper mirror (corrosion) | Low (L) — no removal | IPC-TM-650 2.3.32 |
Reflow Profile (Reference)
| Stage | Setting |
|---|
| Ramp-up to soak | 1–2°C/s up to 150°C |
| Soak / preheat | 150–200°C for 60–120 s |
| Peak temperature | 235–250°C (typ. 245°C) |
| Time above liquidus (> 220°C) | 45–90 s |
| Cooling rate | ≤ 4°C/s |
Handling & Storage
Store refrigerated at 2–10°C (36–50°F). Do not freeze. Shelf life is 6 months from date of manufacture when stored unopened in the original container. Allow the sealed syringe to reach room temperature (20–25°C) for at least 4 hours before opening — opening while cold causes moisture condensation, spattering and solder balling. After opening, re-cap and store upright in the refrigerator; best used within 2 weeks of opening. Consult the Safety Data Sheet for specific handling procedures.
Flux
tinvoa SAC305 solder paste contains an integrated rosin-based no-clean flux classified as ROL0 per IPC J-STD-004B (Rosin base, Low activity, halide-free). Halide content is below 0.05%. Flux content is approximately 12.0% by weight; metal content approximately 88.0% by weight.
Cleaning
No cleaning required. The no-clean flux residue is non-conductive and non-corrosive and may remain on the assembly. If cleaning is desired for aesthetic or conformal-coating reasons, use an IPA-based solvent.
Safety
Use with adequate ventilation and proper personal protective equipment; avoid breathing solder fumes and avoid skin/eye contact. Refer to the product Safety Data Sheet for GHS classification, hazard and precautionary statements, and transport information. Do not dispose of any hazardous materials in non-approved containers.
DISCLAIMER The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of proper handling and operating conditions. Typical values are not specifications and must be confirmed against the supplier Certificate of Analysis (CoA). Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to www.tinvoa.co/terms to review tinvoa™ terms and conditions.