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Contains lead tinvoa Sn62/Pb36/Ag2 leaded solder paste syringe — 179°C, anti-silver-leach, for Ag / Ag-Pd terminations
Solder Paste · Leaded

Sn62 / Pb36 / Ag2 Silver-Bearing Leaded Solder Paste

Sn 62% / Pb 36% / Ag 2% · 179°C · anti-silver-leach
179°C melt2% silverNo-Clean REL0Halide-freeIPC J-STD-004B
Specialty · B2B — quote only
Quote & datasheet on request

This leaded alloy is a specialty product for soldering silver / silver-palladium terminations. Sold direct for professional and OEM use — not listed on Amazon. Tell us your termination type, pad/pitch, and volume and we'll reply with pricing, formats, and full documentation.

Available formats: 30 g · 50 g resealable luer-lock syringe · bulk jar, custom packaging & private label on request
Request a Quote Request Datasheet & SDS
  • 2% Ag suppresses silver leaching on Ag / Ag-Pd pads
  • No-Clean REL0 resin flux · halide-free (IPC J-STD-004B)
  • Fine-pitch print · stencil life > 8 h continuous
  • SDS + Prop 65 warning + hazmat docs with every order

⚠️ WARNING (California Prop 65): This product can expose you to lead, which is known to the State of California to cause cancer and birth defects or other reproductive harm. — For professional / industrial use only. Contains lead: not RoHS-compliant (intended for leaded-process and RoHS-exempt applications). Ships with SDS; transport classification per SDS Section 14. www.P65Warnings.ca.gov

Why Sn62/Pb36/Ag2

Built for silver-metallized parts.

A standard tin-lead solder will dissolve thin silver layers during reflow. The 2% silver in this alloy stops that — protecting the very components other pastes damage.

Anti-silver-leach

2% dissolved silver pre-saturates the melt, so it no longer scavenges silver from Ag / Ag-Pd terminations and platings.

179°C near-eutectic

Slightly lower melt than Sn63/Pb37 (183°C), with smooth wetting and bright, reliable leaded joints.

Fine-pitch printing

Fine powder options and >8 h open stencil time hold definition on small pads and tight pitch.

No-Clean, REL0

Halide-free synthetic-resin flux — <0.05% by weight in flux solids (IPC-TM-650 2.3.28.1) — no cleaning required after reflow.

The silver problem

What the 2% silver actually does.

"Silver leaching" (or silver scavenging) is when molten solder dissolves the thin silver metallization on a component. Add silver to the solder and the driving force disappears.

Plain Sn-Pb solder

Silver dissolves into the joint

Molten Sn63/Pb37 is "hungry" for silver. On a silver or silver-palladium termination it rapidly dissolves the thin Ag layer into the solder.

The result: eroded metallization, weak or open joints, and reduced adhesion — especially with repeated or prolonged heating.

Sn62/Pb36/Ag2

Silver is already saturated

Pre-loading the solder with 2% silver raises its silver activity to near saturation, so it no longer pulls silver out of the component's termination.

The metallization stays intact, the joint is strong and repeatable — exactly what silver-terminated passives and thick-film parts need.

PURPOSE-BUILT FOR

Chip resistors & MLCCs
Passives with fired silver or Ag-Pd end terminations.
LTCC & thick-film
Low-temp co-fired ceramics and printed Ag / Ag-Pd conductors.
Silver-plated pads
Ag-immersion or silver-plated boards and hybrid substrates.
Hybrid & RF modules
Ceramic hybrids and RF assemblies using silver metallization.
Technical Specifications

Engineering data sheet.

Typical values for tinvoa Sn62/Pb36/Ag2 leaded solder paste. Full TDS and SDS supplied on request.

Typical values are not specifications. Lot-specific data available on request.

Alloy CompositionSn 62% / Pb 36% / Ag 2%
Melting Point179°C (near-eutectic)
Silver FunctionSuppresses silver leaching on Ag / Ag-Pd terminations
AppearanceGray smooth paste · odourless
Paste Density≈ 4.6 g/cm³
Powder Particle SizeType 4 · 20–38 μm or Type 5 · 15–25 μm · by format (IPC J-STD-005A)
Flux TypeNo-Clean Synthetic Resin · REL0 (IPC J-STD-004B)
Halide ContentHalide-free — <0.05% by weight in flux solids (IPC-TM-650 2.3.28.1, ion chromatography)
Printability / Open Time> 8 h continuous printing · print speed up to 150 mm/s
Tack / AdhesionHolds components > 24 h after print
Surface Insulation Resistance> 2.6 × 10¹⁰ Ω after 7 days (85°C / 85% RH)
StandardsISO 9454-1 (1.2.2.3) · IPC J-STD-004B
CleaningNo-Clean — cleaning not required (alcohol PCB cleaner if desired)
Recommended Stencil100 μm foil for pitch ≤ 0.4 mm · 150 μm for pitch ≥ 0.5 mm
Package Options30 g / 50 g · resealable luer-lock syringe · SKU TSP-PB36AG2-30G / -50G
Storage / Shelf Life6 months refrigerated (2–10°C / 36–50°F), tightly sealed · warm to room temp before opening
Lead Content / ComplianceContains lead — not RoHS-compliant · California Prop 65 warning applies · DOT ground: typically non-regulated · air/ocean: verify SDS Section 14
Recommended Reflow Profile

Leaded 210–220°C peak.

Sn62/Pb36/Ag2 melts at 179°C. Target a 210–220°C peak with 30–60 s above melt. Depending on oven vs. hot-air, you may need +10–20°C over the nominal profile.

250°C 200°C 150°C 100°C 50°C 0°C 0s 60s 120s 180s 240s 300s 179°C melt PREHEAT SOAK REFLOW COOLING Peak 210–220°C
1 · Preheat
25 → 130–150°C
≤ 3 °C/s · 60–120 s · avoid spatter
2 · Soak
140 → 170°C
1.0–1.5 °C/s · 60–90 s · activates flux
3 · Reflow / Peak
210–220°C peak
Time above 179°C: 30–60 s
4 · Cooling
Peak → ambient
Controlled cooling ≤ 6 °C/s

Suitable for reflow in air or nitrogen, and stencil printing with laser-cut or electroformed foils. Full guidance in the TDS ↓.

Safety & Hazard Information

GHS hazard communication.

Leaded alloy. Classified under OSHA HazCom 2024 (GHS). Refer to the product SDS for the complete, authoritative classification.

GHS07
Irritant / Sensitizer
GHS08
Health Hazard
GHS09
Environment
Signal word: DANGER

Hazard statements

  • H360FD · May damage fertility or the unborn child.
  • H372 · Causes damage to organs through prolonged or repeated exposure (lead).
  • H362 · May cause harm to breast-fed children.
  • H410 · Very toxic to aquatic life with long lasting effects.
  • H317 · May cause an allergic skin reaction (flux).

Precautionary statements

  • P201 · Obtain special instructions before use.
  • P260 · Do not breathe dust or fumes.
  • P263 · Avoid contact during pregnancy and while nursing.
  • P264 · Wash hands thoroughly after handling.
  • P270 · Do not eat, drink or smoke when using this product.
  • P272 · Contaminated work clothing must not be allowed out of the workplace.
  • P273 · Avoid release to the environment.
  • P280 · Wear protective gloves and eye protection.
  • P302+P352 · IF ON SKIN: Wash with plenty of water.
  • P308+P313 · IF exposed or concerned: Get medical advice or attention.
  • P333+P313 · If skin irritation or rash occurs: Get medical advice or attention.
  • P391 · Collect spillage.
  • P501 · Dispose of contents and container in accordance with applicable local, regional, national and international regulations.
California Proposition 65 — WARNING

This product can expose you to lead, which is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information go to www.P65Warnings.ca.gov.

Full classification in the Safety Data Sheet ↓

Compliance & Documents

Full QA paperwork.

Because this is a leaded product, documentation is provided directly on inquiry so we can confirm your application and destination.

Technical
Technical Data Sheet (TDS)

Sn62/Pb36/Ag2 alloy specs — physical/chemical properties, silver-leach behaviour, and the leaded reflow profile.

View document
Process
Instructions for Use (IFU)

Bench guide: warming, stencil printing, reflow at 210–220°C peak, and post-reflow inspection.

View 30 g View 50 g
Safety
Safety Data Sheet (SDS)

OSHA/GHS-compliant safety info for a lead-bearing solder — handling, storage, first-aid, hazmat transport, disposal.

Request document
Compliance
RoHS Statement

Lead-exemption status under EU directives 2011/65/EU and 2015/863 — for applications outside EU RoHS scope (e.g., military, aerospace) or covered by a specific RoHS exemption.

Request document
Compliance
REACH Compliance Letter

SVHC declaration under EU REACH (EC 1907/2006). Lead is a listed Substance of Very High Concern.

Request document
Quality
Certificate of Conformance (CoC)

Lot-traceable statement of conformance to this product's specification. Issued per lot with wholesale orders.

Request document
FAQ

Sn62/Pb36/Ag2 paste — questions.

What is Sn62/Pb36/Ag2 solder paste used for?

Soldering parts with silver or silver-palladium terminations — chip resistors and capacitors with Ag-Pd ends, LTCC, and silver-plated pads. Plain tin-lead dissolves thin silver layers during reflow (silver leaching); the 2% silver in Sn62/Pb36/Ag2 suppresses it. The alloy melts at 179°C.

What reflow profile does Sn62/Pb36/Ag2 need?

Peak at 210–220°C with 30–60 s above 179°C, after a 140–170°C soak. It works in air or nitrogen. For stencil printing, use a 100 µm foil for pitches of 0.4 mm and below, and 150 µm for 0.5 mm and above.

How do I order Sn62/Pb36/Ag2?

By inquiry only — it is not sold on Amazon. It comes in 30 g and 50 g syringes, with bulk jars, custom packaging and private label on request. It contains lead, is not RoHS-compliant, and carries a California Prop 65 warning. Send an inquiry.

Soldering silver terminations?
Talk to us.

Sn62/Pb36/Ag2 is a specialty leaded alloy sold direct — not on Amazon. Tell us your parts and volume and we'll send pricing, formats, and full compliance documentation.

Request a Quote Request Datasheet & SDS