Home/Products/Sn42/Bi57.6/Ag0.4 Low-Temp Solder Paste
tinvoa Sn42/Bi57.6/Ag0.4 silver-added low-temp solder paste — 15 g syringe, 138°C melt, Type 4 powder, No-Clean ROL0 flux, RoHS-compatible
Solder Paste · Low Temperature · Silver-Added

Sn42 / Bi57.6 / Ag0.4 Silver-Added Low-Temperature Solder Paste

Sn 42.0% / Bi 57.6% / Ag 0.4% · Silver-Added Bismuth-Tin
138°C melt+ Ag 0.4%15 gIPC J-STD-005ANo-Clean ROL0Halide-free
Package Size
$15.99/ syringe
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  • 0.4% silver added to the 138°C tin-bismuth system
  • RoHS-compatible · REACH SVHC declared · halide-free flux
  • Tested using IPC J-STD-005A methods
  • 6-month shelf life refrigerated (2–10°C)
Technical Specifications

Engineering data sheet.

Complete specs for Sn42/Bi57.6/Ag0.4 silver-added low-temp solder paste.

Typical values are not specifications. Lot-specific data available on request.

Alloy CompositionSn 42.0% / Bi 57.6% / Ag 0.4%
Melting Point138°C solidus · near-eutectic
Flux TypeNo-Clean Rosin · ROL0 (IPC J-STD-004B)
Halide ContentHalide-free — <0.05% by weight in flux solids (IPC-TM-650 2.3.28.1, ion chromatography)
Powder Particle SizeType 4 · 20–38 μm · ultrasonic-atomized powder by Lingsko (how it's made)
Metal Content (wt %)≈ 88.5 ± 0.5%
Package Options15 g · resealable luer-lock syringe · SKU TSP-BI57AG-T4-15G
Shelf Life6 months refrigerated (2–10°C) · ≥ 24 h working time
ComplianceRoHS · REACH SVHC declared · Flux ROL0 per IPC J-STD-004B · Paste per IPC J-STD-005A · Alloy per IPC J-STD-006C
Recommended Stencil4–6 mil (Type 4) · area ratio ≥ 0.66
Recommended Reflow Profile

Cool, controlled, low-temp reflow.

The 0.4% silver addition does not change the low-temp profile: reflow ~30°C above the 138°C melt. Keep peak ≤170°C — excess heat oxidizes bismuth and degrades joint strength.

250°C 200°C 150°C 100°C 50°C 0°C 0s 60s 120s 180s 240s 300s 138°C melt PREHEAT SOAK REFLOW COOLING Peak 165°C
1 · Preheat
25 → 100°C
Ramp 1–2 °C/s · ~45–60 s
2 · Soak
100 → 130°C
Dwell 60–90 s · activates flux
3 · Reflow / Peak
160–170°C peak
Time above 138°C: 30–60 s
4 · Cooling
170 → 80°C
Controlled cooling ≤ 4 °C/s

For LED strip hand-soldering: use a 1.0 mm hot-air nozzle and bring the joint to 160–170°C (the tool set point usually needs to be higher). Hold for 3–5 s after melt flow is visible. Full guidance in the TDS ↓.

Safety & Hazard Information

GHS hazard communication.

Silver-added bismuth-tin alloy. Classified under OSHA HazCom 2024 (GHS). Refer to the product SDS for the complete, authoritative classification.

GHS07
Irritant / Sensitizer
GHS09
Environment
Signal word: WARNING

Hazard statements

  • H410 · Very toxic to aquatic life with long lasting effects.
  • H317 · May cause an allergic skin reaction (flux).

Precautionary statements

  • P261 · Avoid breathing dust or fumes.
  • P272 · Contaminated work clothing must not be allowed out of the workplace.
  • P273 · Avoid release to the environment.
  • P280 · Wear protective gloves.
  • P302+P352 · IF ON SKIN: Wash with plenty of water.
  • P333+P313 · If skin irritation or rash occurs: Get medical advice or attention.
  • P362+P364 · Take off contaminated clothing and wash it before reuse.
  • P391 · Collect spillage.
  • P501 · Dispose of contents and container in accordance with applicable local, regional, national and international regulations.

California Proposition 65: no listed chemical is intentionally added to this lead-free formulation.

Compliance & Documents

Full QA paperwork.

Technical
Technical Data Sheet (TDS)

Sn42/Bi57.6/Ag0.4 alloy composition, flux, handling and safety data (138 °C solidus).

View document
Process
Instructions for Use (IFU)

Step-by-step low-temp bench guide: warming, stencil printing, reflow at 160–170 °C peak, post-reflow inspection.

View 15 g
Safety
Safety Data Sheet (SDS)

OSHA/GHS-compliant safety information. Handling, storage, first-aid, transport, and disposal protocols.

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Compliance
RoHS Declaration

Lead-free verification under EU directive 2011/65/EU and 2015/863.

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Compliance
REACH Compliance Letter

SVHC (Substances of Very High Concern) declaration under EU REACH (EC 1907/2006).

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Quality
Certificate of Conformance (CoC)

Lot-traceable statement of conformance to this product's specification. Issued per lot with wholesale orders.

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FAQ

Silver-added low-temp paste — questions.

How is Sn42/Bi57.6/Ag0.4 different from Sn42/Bi58?

It is the same low-temperature bismuth-tin system with 0.4% silver added. The melt point and reflow profile are essentially unchanged (138°C). Small silver additions are used across the industry to refine the tin-bismuth microstructure, which generally makes joints less brittle than plain Sn42/Bi58. Choose it when joints will see some flexing or thermal cycling; choose Sn42/Bi58 when you want the larger 30 g or 50 g sizes.

Is Sn42/Bi57.6/Ag0.4 good for LED strips and flex circuits?

Yes. Like Sn42/Bi58 it melts at 138°C, so it protects LED adhesives, flex substrates and heat-sensitive parts. In an oven or on a hot plate, peak at 160–170°C with 30–60 s above 138°C. With hot air, use a 1.0 mm nozzle and bring the joint to 160–170°C — the tool's set point usually needs to be higher — then hold for 3–5 s after the paste flows.

Can I use it on parts with leaded solder?

No. Lead mixed into tin-bismuth forms a phase that melts near 96°C and weakens the joint. Remove old tin-lead solder completely before reworking, and don't use it on tin-lead plated leads or pads.

Why only a 15 g syringe?

Silver-added low-temp paste is mostly used for repair, rework and small batches, where 15 g is enough and stays fresh. It is the same Type 4 (20–38 µm) paste with no-clean ROL0 flux in a resealable luer-lock syringe. Use 20G–22G needles; Type 4 paste suits pitches of about 0.5 mm and above. For bulk quantities, request a wholesale quote.

Low temperature.
Silver-added.

Sn42/Bi57.6/Ag0.4 ships from our U.S. warehouse — $4.99 flat, free on orders of $49.99+ with code FREESHIP. Bulk and OEM orders ship with full compliance docs.

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