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Sn62/Pb36/Ag2 is composed of 62% tin, 36% lead, and 2% silver, formulated as a no-clean solder paste for reflow assembly. The silver addition is functional, not incidental: a standard tin-lead solder rapidly dissolves thin silver metallization during reflow, eroding the termination and weakening the joint. By pre-loading the alloy with 2% silver, its silver activity is raised close to saturation, removing the driving force for that dissolution. It is the preferred choice for soldering silver / silver-palladium terminations found on chip resistors and MLCCs, LTCC and thick-film hybrid conductors, silver-plated pads, and ceramic/RF modules. Melting point is 179°C (354°F).
| Sn | Pb | Ag |
|---|---|---|
| Sn: 62.0 ± 0.5% | Pb: 36.0 ± 0.5% | Ag: 2.0 ± 0.2% |
| Property | Typical Value |
|---|---|
| Appearance | Gray smooth paste, odourless |
| Melting point | 179°C (354°F) |
| Paste density | ≈ 4.6 g/cm³ |
| Powder particle size | Type 4: 25–45 μm · Type 5: 15–25 μm (by format) |
| Flux classification | REL0 (IPC J-STD-004) · No-Clean, halide-free |
| Chromatographic chloride test | Pass (REL0) · IPC TM-650 |
| Printability / open time | > 8 h continuous · print speed up to 150 mm/s |
| Tack / adhesion | Holds components > 24 h after print |
| Surface insulation resistance | > 2.6 × 10¹⁰ Ω after 7 days (85°C / 85% RH) |
| Standards | ISO 9454-1 (1.2.2.3) · IPC J-STD-004 |
| Stage | Temperature | Time / Rate |
|---|---|---|
| Preheat | 25–130/150°C | ≤ 3°C/sec · 60–120 s |
| Soak | 140–170°C | 1.0–1.5°C/sec · 60–90 s |
| Reflow | 210–220°C (Peak) | TAL above 179°C: 30–60 s |
| Cooling | ≤ 6°C/sec | Controlled |
Suitable for reflow in air or nitrogen. Depending on equipment (oven / hot air) it may be necessary to raise the profile by 10–20°C. Use active fume extraction — lead-containing vapors are harmful.
Use laser-cut or electroformed stencils. Recommended foil thickness: 100 μm for pitches up to 0.4 mm, 150 μm for pitches of 0.5 mm and above. Use metal squeegees at 25–150 mm/s with 1.5–3 N per cm of blade length. Maintain a rolling bead of paste 15–20 mm in front of the squeegee.
Store refrigerated at 2–10°C (36–50°F) in a tightly sealed container. Do not freeze. Shelf life is 6 months from date of manufacture when stored unopened. Allow the paste to reach room temperature (23–26°C, max 28°C) before opening to avoid moisture condensation. Do not mix used paste with fresh paste. Store away from food, children, and pregnant individuals. Consult the Safety Data Sheet for specific handling procedures.
tinvoa Sn62/Pb36/Ag2 solder paste contains an integrated no-clean flux classified as REL0 per IPC J-STD-004 (Rosin base, Low activity, halide-free / L0). Halide content is below detectable limits and passes the IPC-TM-650 chromatographic chloride test.
No cleaning required. The no-clean flux residue is non-conductive and non-corrosive and may remain on the assembly. If cleaning is desired, use an alcohol/IPA-based PCB cleaner to remove residues without damaging components.
Use with adequate ventilation, active fume extraction, and proper personal protective equipment (nitrile gloves, safety glasses). This product contains lead. Classified as H332 (harmful if inhaled), H360FD (may damage fertility/unborn child), H373 (may cause damage to organs through prolonged lead exposure), and H410 (very toxic to aquatic life). GHS pictograms: GHS08 (Health Hazard) + GHS09 (Environment). Signal word: DANGER. California Proposition 65 Warning: This product contains LEAD, known to the State of California to cause cancer, birth defects, and other reproductive harm — www.P65Warnings.ca.gov. Wash hands thoroughly with soap and water after handling. Refer to the accompanying Safety Data Sheet for emergency and transport information.