Technical Data Sheet
™
Solder Paste & Precision Soldering

SN62/PB36/AG2 SILVER-BEARING LEADED SOLDER PASTE

DANGER · CONTAINS LEAD — For RoHS-exempt applications only (military, medical, aerospace, industrial). Not for consumer electronics under EU RoHS Directive.
WHY 2% SILVER: The added silver saturates the molten solder so it no longer dissolves (leaches) silver from Ag or Ag-Pd terminations. Purpose-built for soldering silver-metallized parts — chip resistors/MLCCs, LTCC and thick-film Ag/Ag-Pd conductors, and silver-plated pads — where plain Sn-Pb solder would erode the metallization.

Features

Description

Sn62/Pb36/Ag2 is composed of 62% tin, 36% lead, and 2% silver, formulated as a no-clean solder paste for reflow assembly. The silver addition is functional, not incidental: a standard tin-lead solder rapidly dissolves thin silver metallization during reflow, eroding the termination and weakening the joint. By pre-loading the alloy with 2% silver, its silver activity is raised close to saturation, removing the driving force for that dissolution. It is the preferred choice for soldering silver / silver-palladium terminations found on chip resistors and MLCCs, LTCC and thick-film hybrid conductors, silver-plated pads, and ceramic/RF modules. Melting point is 179°C (354°F).

Typical Alloy Composition

SnPbAg
Sn: 62.0 ± 0.5%Pb: 36.0 ± 0.5%Ag: 2.0 ± 0.2%

Physicochemical Properties

PropertyTypical Value
AppearanceGray smooth paste, odourless
Melting point179°C (354°F)
Paste density≈ 4.6 g/cm³
Powder particle sizeType 4: 25–45 μm · Type 5: 15–25 μm (by format)
Flux classificationREL0 (IPC J-STD-004) · No-Clean, halide-free
Chromatographic chloride testPass (REL0) · IPC TM-650
Printability / open time> 8 h continuous · print speed up to 150 mm/s
Tack / adhesionHolds components > 24 h after print
Surface insulation resistance> 2.6 × 10¹⁰ Ω after 7 days (85°C / 85% RH)
StandardsISO 9454-1 (1.2.2.3) · IPC J-STD-004

Recommended Reflow Profile

StageTemperatureTime / Rate
Preheat25–130/150°C≤ 3°C/sec · 60–120 s
Soak140–170°C1.0–1.5°C/sec · 60–90 s
Reflow210–220°C (Peak)TAL above 179°C: 30–60 s
Cooling≤ 6°C/secControlled

Suitable for reflow in air or nitrogen. Depending on equipment (oven / hot air) it may be necessary to raise the profile by 10–20°C. Use active fume extraction — lead-containing vapors are harmful.

Stencil Printing

Use laser-cut or electroformed stencils. Recommended foil thickness: 100 μm for pitches up to 0.4 mm, 150 μm for pitches of 0.5 mm and above. Use metal squeegees at 25–150 mm/s with 1.5–3 N per cm of blade length. Maintain a rolling bead of paste 15–20 mm in front of the squeegee.

Handling & Storage

Store refrigerated at 2–10°C (36–50°F) in a tightly sealed container. Do not freeze. Shelf life is 6 months from date of manufacture when stored unopened. Allow the paste to reach room temperature (23–26°C, max 28°C) before opening to avoid moisture condensation. Do not mix used paste with fresh paste. Store away from food, children, and pregnant individuals. Consult the Safety Data Sheet for specific handling procedures.

Flux

tinvoa Sn62/Pb36/Ag2 solder paste contains an integrated no-clean flux classified as REL0 per IPC J-STD-004 (Rosin base, Low activity, halide-free / L0). Halide content is below detectable limits and passes the IPC-TM-650 chromatographic chloride test.

Cleaning

No cleaning required. The no-clean flux residue is non-conductive and non-corrosive and may remain on the assembly. If cleaning is desired, use an alcohol/IPA-based PCB cleaner to remove residues without damaging components.

Safety

Use with adequate ventilation, active fume extraction, and proper personal protective equipment (nitrile gloves, safety glasses). This product contains lead. Classified as H332 (harmful if inhaled), H360FD (may damage fertility/unborn child), H373 (may cause damage to organs through prolonged lead exposure), and H410 (very toxic to aquatic life). GHS pictograms: GHS08 (Health Hazard) + GHS09 (Environment). Signal word: DANGER. California Proposition 65 Warning: This product contains LEAD, known to the State of California to cause cancer, birth defects, and other reproductive harm — www.P65Warnings.ca.gov. Wash hands thoroughly with soap and water after handling. Refer to the accompanying Safety Data Sheet for emergency and transport information.

DISCLAIMER  The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of proper handling and operating conditions. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Sn62/Pb36/Ag2 is a leaded solder alloy — confirm RoHS-exemption applicability before use. Please refer to www.tinvoa.co/terms to review tinvoa™ terms and conditions.
www.tinvoa.co·[email protected]·SDS: tinvoa.co/sds/sn62pb36ag2