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tinvoa No-Clean Tacky Flux is a high-purity, rosin-based high-tack flux paste for electronics soldering, rework and desoldering. Its raised solids content makes the deposit grip the part — holding a BGA, QFN, LGA or chip component in position from placement through the reflow ramp — while promoting fast, even wetting and removing oxide layers so solder flows smoothly into the joint. Tack force is tested to IPC-TM-650 2.4.44 (adapted) and stated on the certificate of analysis. Suitable for BGA / QFN / LGA reballing, holding components through reflow, stencil printing and pin transfer, and for use with both lead-free and lead-based solder, and with gold, copper, tin, iron and other common metals. Supplied in a 10cc (10 ml) push-rod syringe with dispensing needles — gently push the plunger and the flux flows out smoothly with no waste; reseal the cap after use.
| Flux base | High-purity rosin / modified resin |
| Flux type (IPC J-STD-004) | RO (Rosin), No-Clean |
| Activity classification | ROL0 (Rosin, Low activity, halide-free) |
| Halide content | Halogen-free — no intentionally added halogens. Halide-free <0.05% per IPC J-STD-004 ROL0. |
Typical values. These are not specifications. Confirm against the certificate of analysis supplied with your lot.
| Property | Typical Result |
|---|---|
| Appearance | Amber, translucent, non-slumping tacky paste |
| Specific gravity @ 25°C | ~1.0 |
| Acid value (mg KOH/g) | 135–150 (IPC 2.3.13) |
| Solids content | 72–76% by weight (IPC 2.3.34) |
| Halide content | Halide-free — <0.05% by weight in flux solids per IPC J-STD-004 ROL0 (IPC-TM-650 2.3.28.1) |
| Net content | NET WT 0.35 oz (10 g) · 10 cc syringe |
| Tack force | Tested to IPC-TM-650 2.4.44, applied as an adapted method (2.4.44 is written for solder paste). Value stated on the certificate of analysis. |
| Reflow profile | Ramp 1–2°C/s · dwell 135–160°C for 1–2 min · peak 235–260°C · 45–90 s above liquidus · cool 3–7°C/s |
| Application methods | Dot dispensing · syringe · stencil printing · pin transfer · BGA reballing · rework soldering |
| Recommended iron tip temp. | 300–380°C |
Tested to IPC J-STD-004. Type-test report available on request.
| Test | Result |
|---|---|
| Copper mirror | Low activity (pass) — IPC 2.3.32 |
| Halide qualitative | Halide-free (pass) — IPC 2.3.33 |
| Copper corrosion | No corrosion (pass) — IPC 2.6.15 |
| Surface Insulation Resistance (SIR) | Pass > 1.0×10⁹ Ω (IPC 2.6.3.7) — non-conductive residue |
| Electrochemical migration (ECM) | Pass (IPC 2.6.14.1) |
Store sealed at 10–32°C (50–90°F) in a dry place. Refrigeration is not required. Shelf life is 12 months unopened from date of manufacture, and 6 months after opening, when stored sealed in the original container. Keep away from heat and open flame. Reseal the cap after each use. Consult the Safety Data Sheet for specific handling procedures.
No cleaning required for most applications — the no-clean residue is non-conductive and non-corrosive and may remain on the assembly. Where a clean finish is preferred (e.g. dense or visible boards), remove residue with an IPA-based solvent and a brush.
Use with adequate ventilation; avoid breathing solder/flux fumes. Rosin (colophony) may cause skin or respiratory sensitization in susceptible individuals. Avoid prolonged skin and eye contact; wash hands after use. GHS classification: Pictogram GHS07 · Signal word WARNING · H315 Causes skin irritation · H317 May cause an allergic skin reaction · H319 Causes serious eye irritation · H335 May cause respiratory irritation. Precautionary: P261 · P264 · P271 · P280 · P302+P352 · P305+P351+P338 · P333+P313 · P337+P313 · P501. Keep out of reach of children. Not regulated for transport (DOT / IATA / IMDG). California Proposition 65: rosin (colophony) is not a listed chemical; no warning is required. Keep out of reach of children. Do not dispose of in non-approved containers.