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SN99/AG0.3/CU0.7 LEAD-FREE SOLDER PASTE — SAC0307
Features
- Lead-Free Low-Silver Tin-Silver-Copper Alloy (SAC0307)
- Melting Range 217–227°C (423–441°F) · Liquidus 227°C
- No-Clean · Strong Viscosity · Bright Solder Joints
- Type 4 Powder (20–38 μm) per IPC J-STD-005 · Halide-Free ROL0 Flux
Description
Sn99.0/Ag0.3/Cu0.7 (SAC0307) is a low-silver tin-silver-copper alloy formulated as a no-clean Type 4 solder paste with a 217–227°C (423–441°F) melting range. It is widely used on circuit boards, ICs, phones, TVs and other household appliances and industrial equipment, for both reflow assembly and hand dispensing or rework. The high metal loading (≈88% metal / 12% flux) gives strong viscosity and bright solder joints, and the pushing (scraper) syringe design promotes smoother flow with no waste during soldering. Solidus 217°C (423°F); liquidus approximately 227°C.
Impurity Levels to IPC-J-STD-006 in Percent
| Pb: 0.10 | Bi: 0.10 | Sb: 0.10 | In: 0.10 |
| Al: 0.005 | Au: 0.05 | Fe: 0.02 | Ni: 0.01 |
| As: 0.03 | Cd: 0.002 | Zn: 0.003 | Total others: 0.20 |
Major Alloy Ingredients in Percent
| Sn | Ag | Cu |
|---|---|---|
| Sn: 99.0 (bal.) | Ag: 0.3 ± 0.1 | Cu: 0.7 ± 0.1 |
Typical Properties
| Properties | Results |
|---|---|
| Solidus / Liquidus Temperature °C | 217 / 227 |
| Density g/cc | 7.38 |
| Electrical Conductivity % of IACS | 13 |
| Thermal Conductivity W/m-°C | 58 |
| Coefficient of Thermal Expansion PPM/°C | 21 |
| Tensile Strength PSI | 5,800 |
| Elongation % | 35 |
| Brinell Hardness | 15 |
Reflow Profile (Reference)
| Stage | Setting |
|---|---|
| Ramp-up to soak | 1–2°C/s up to 150°C |
| Soak / preheat | 150–200°C for 60–120 s |
| Peak temperature | 240–250°C (target 245°C) |
| Time above liquidus (>227°C) | 60–90 s |
| Cooling rate | ≤ 4°C/s |
Handling & Storage
Store refrigerated at 2–10°C (36–50°F). Do not freeze. Shelf life is 6 months from date of manufacture when stored unopened in the original container. Allow the sealed syringe to reach room temperature (20–25°C) for at least 4 hours before opening — opening while cold causes moisture condensation, spattering and solder balling. After opening, re-cap and store upright in the refrigerator. Consult the Safety Data Sheet for specific handling procedures.
Flux
tinvoa SAC0307 solder paste contains an integrated synthetic no-clean flux classified as ROL0 per IPC J-STD-004 (Rosin base, Low activity, Halide-free). Halide content is below detectable limits. Flux content is approximately 12% by weight; metal content approximately 88% by weight.
Cleaning
No cleaning required. The no-clean flux residue is non-conductive and non-corrosive and may remain on the assembly. If cleaning is desired for aesthetic or coating reasons, use an IPA-based solvent.
Safety
Use with adequate ventilation and proper personal protective equipment; avoid breathing solder fumes and avoid skin/eye contact. Refer to the SAC0307 Safety Data Sheet (available on request) for GHS classification, hazard and precautionary statements, and transport information. California Proposition 65: no listed chemical is intentionally added to this lead-free formulation (see SDS Section 15). Do not dispose of any hazardous materials in non-approved containers.