™INSTRUCTIONS FOR USE
DOC-IFU-SAC0307-50G-001-EN · Rev. A · 2026-07-25
Sn99.0/Ag0.3/Cu0.7 Solder Paste
SAC0307 · No-Clean · Halogen-Free · 50g Net Jar · Stencil Printing
Lead-Free
No-Clean ROL0
Halide-Free
Type 4
RoHS · REACH
IPC J-STD-005
ALLOY
SAC0307
SOLIDUS / LIQUIDUS
217 / 227°C
POWDER TYPE
Type 4 · 20–38 µm
NET WT
50 g
1
APPLICATIONS
Stencil Printing
SMT Assembly Lines
BGA / QFN Rework
Prototype Batches
Consumer Electronics
Industrial Equipment
The 50 g jar is intended for stencil / screen printing and spatula dispensing. For hand-dispensing onto individual pads, use the 30 g luer-lock syringe (SKU TSP-SAC0307-30G).
2
SPECIFICATIONS
| Alloy Composition | Sn 99.0% (bal.) / Ag 0.3 ±0.1% / Cu 0.7 ±0.1% |
| Net Weight | 50 g (1.76 oz) |
| Solidus / Liquidus | 217°C / 227°C (10°C mushy zone) |
| Alloy Density | 7.40 g/cm³ |
| Powder Type | Type 4 (20–38 µm) |
| Flux Type | No-Clean Rosin · ROL0 (IPC J-STD-004) |
| Halide Content | Halide-free (< 0.05%) |
| Metal Content | 88.0 ± 0.5 wt% |
| Flux Content | ≈ 12.0 wt% |
| Viscosity | 180 ± 30 Pa·s (Malcom PCU-205, 10 rpm, 25°C) |
| Tackiness | 30–40 gf (4 h after print) |
| Slump Resistance | Pass IPC-TM-650 2.4.35 |
| Compliance | RoHS · REACH SVHC declared · Flux ROL0 per IPC J-STD-004B · Paste per IPC J-STD-005A · Alloy per IPC J-STD-006C |
| SKU | TSP-SAC0307-50G |
3
STENCIL PRINTING PARAMETERS
| Stencil thickness | 0.10–0.15 mm (4–6 mil), laser-cut & electropolished |
| Aperture area ratio | ≥ 0.66 (Type 4 powder) |
| Squeegee | Metal blade, 45–60° |
| Print speed | 20–80 mm/s |
| Print pressure | ≈ 0.2 kg per 25 mm of blade |
| Snap-off | 0 mm (on-contact printing) |
| Rolling bead diameter | 10–15 mm on the stencil |
| Idle / abandon time on stencil | ≤ 4 h — knead the bead if paused longer |
| Working time at 20–25°C | ≥ 24 h once warmed |
| Print-to-reflow window | Reflow within 4–8 h of printing |
Values are starting points for a Type 4 SAC0307 paste. Qualify them on your own stencil, board and printer before production.
4
REFLOW PROFILE
Recommended Reflow Profile for SAC0307
1 · Preheat
25–150°C
1–2°C/s · 60–90 s
2 · Soak
150–200°C
60–120 s
3 · Reflow
240–250°C
Peak: 245°C
4 · Cooling
≤ 4°C/s
250 → 100°C
Time above liquidus (227°C): 60–90 s. SAC0307 has a wider 10°C mushy zone than SAC305 — always profile to the 227°C liquidus, not the 217°C solidus. Validate on your own thermal-mass test board.
5
TROUBLESHOOTING
Skipped or partially filled apertures
Paste too cold or too stiff, print speed too high, or area ratio below 0.66. Confirm the jar reached room temperature, slow the squeegee to 20–40 mm/s, and check aperture design.
Smearing / paste under the stencil
Excess squeegee pressure or non-zero snap-off. Reduce pressure to about 0.2 kg per 25 mm of blade, print on-contact, and wipe the stencil underside.
Slump or bridging after print
Stencil too thick for the pitch, or the board sat too long before reflow. Use a 0.10–0.12 mm stencil for fine pitch and reflow within 4–8 h.
Solder balls / spattering
Moisture from opening the jar cold, or too short a soak. Always warm the jar sealed for 4 h+, and extend the 150–200°C soak.
Dull, grainy joints
Peak too low or TAL too short. Raise the peak toward 250°C and hold 60–90 s above 227°C.
Paste dries or crusts on the stencil
Left idle too long. Knead the bead back together; replace it if it has skinned over. Never scrape crusted paste back into the jar.
6
HOW TO USE
1
Warm the sealed jar
Take the jar from the refrigerator and let it reach room temperature (20–25°C) with the lid closed. Allow at least 4 hours — up to 8 hours for a full, cold jar. Never microwave it, run it under hot water, or apply direct heat.
Opening a cold jar condenses moisture → solder balls2
Stir gently
Open the jar and stir for 20–30 seconds with a clean stainless-steel or plastic spatula, folding the paste rather than whipping it. Do not use a high-speed mechanical mixer — it shears the flux and can separate the paste.
3
Prepare board and stencil
Clean the PCB pads with 99% IPA and let them dry. Mount and align the stencil on-contact (0 mm snap-off). Work with source-capture fume extraction; wear nitrile gloves and safety glasses with side shields.
Keep your head out of the solder-fume plume4
Load paste onto the stencil
Take out only the paste you will use in the next few hours and place it as a 10–15 mm rolling bead ahead of the squeegee. Never return used paste to the jar. Close the jar and refrigerate it again immediately.
5
Print
Squeegee at 20–80 mm/s with about 0.2 kg of pressure per 25 mm of blade, at 45–60°. The bead should roll, not smear. Inspect the first board for full, brick-shaped deposits before running the batch.
Print, then inspect — before you print fifty boards6
Place components and reflow
Place parts within the tack window (30–40 gf holds them). Reflow per Section 4: peak 240–250°C, 60–90 s above 227°C, cooling ≤ 4°C/s. Reflow within 4–8 hours of printing.
7
Inspect and clean up
Good joints are bright and fully wetted. The ROL0 no-clean, halide-free residue is non-conductive and non-corrosive and may be left on the assembly. Clean the stencil and tools with a stencil cleaner or 99% IPA, following that solvent’s own SDS and eliminating ignition sources.
7
SAFETY INFORMATION
WARNING
Hazard statements — H317 May cause an allergic skin reaction (rosin / colophony).
Precautionary statements — P261 Avoid breathing dust or fumes. P264 Wash hands and exposed skin thoroughly after handling. P272 Contaminated work clothing must not be allowed out of the workplace. P280 Wear protective gloves, eye protection and protective clothing. P302+P352 IF ON SKIN: Wash with plenty of soap and water. P333+P313 If skin irritation or rash occurs: Get medical advice or attention. P362+P364 Take off contaminated clothing and wash it before reuse. P501 Dispose of contents and container in accordance with local, regional and national regulations.
KEEP OUT OF REACH OF CHILDREN.
DO NOT
✗ Swallow, or allow contact with eyes — rinse with water for at least 15 minutes.
✗ Discard with household waste — follow local hazardous-waste rules.
✗ Use near open flame, or heat the container directly.
FIRST AID — Skin: wash with soap and water. Eyes: rinse with water for 15 minutes. Inhaled: move to fresh air. Swallowed: rinse mouth, do NOT induce vomiting. If symptoms persist, get medical advice. Poison Control 1-800-222-1222 (USA).
STORAGE — Refrigerate 2–10 °C (36–50 °F). Do not freeze. Bring the sealed jar to room temperature for 4–8 h before opening. Shelf life 6 months unopened; use within 3 weeks after opening.
For professional and hobbyist electronics assembly and repair. Not for human consumption or food-contact use. Transport classification: see SDS Section 14.
Full Safety Data Sheet
tinvoa.co/sds/sac0307
™SKU TSP-SAC0307-50G · DOC-IFU-SAC0307-50G-001-EN · Rev. A · Safety content per SDS LSK-SDS-SAC0307 v1.2 (2026-07-21)
www.tinvoa.co