™INSTRUCTIONS FOR USE
DOC-IFU-SAC0307-30G-001-EN · Rev. B · 2026-07-25
Sn99.0/Ag0.3/Cu0.7 Solder Paste
SAC0307 · No-Clean · Halogen-Free · 30g Net Syringe
Lead-Free
No-Clean ROL0
Halide-Free
Type 4
RoHS · REACH
IPC J-STD-005
ALLOY
SAC0307
SOLIDUS / LIQUIDUS
217 / 227°C
POWDER TYPE
Type 4 · 20–38 µm
NET WT
30 g
1
APPLICATIONS
Circuit Boards
IC Components
Phone Repair
TV / Appliances
Industrial Equipment
SMT Reflow & Rework
2
SPECIFICATIONS
| Alloy Composition | Sn 99.0% (bal.) / Ag 0.3 ±0.1% / Cu 0.7 ±0.1% |
| Net Weight | 30 g (1.06 oz) |
| Solidus / Liquidus | 217°C / 227°C (10°C mushy zone) |
| Alloy Density | 7.40 g/cm³ |
| Powder Type | Type 4 (20–38 µm) |
| Flux Type | No-Clean Rosin · ROL0 (IPC J-STD-004) |
| Halide Content | Halide-free (< 0.05%) |
| Metal Content | 88.0 ± 0.5 wt% |
| Flux Content | ≈ 12.0 wt% |
| Viscosity | 180 ± 30 Pa·s (Malcom PCU-205, 10 rpm, 25°C) |
| Tackiness | 30–40 gf (4 h after print) |
| Slump Resistance | Pass IPC-TM-650 2.4.35 |
| Compliance | RoHS · REACH SVHC declared · Flux ROL0 per IPC J-STD-004B · Paste per IPC J-STD-005A · Alloy per IPC J-STD-006C |
| SKU | TSP-SAC0307-30G |
3
REFLOW PROFILE
Recommended Reflow Profile for SAC0307
1 · Preheat
25–150°C
1–2°C/s · 60–90 s
2 · Soak
150–200°C
60–120 s
3 · Reflow
240–250°C
Peak: 245°C
4 · Cooling
≤ 4°C/s
250 → 100°C
Time above liquidus (227°C): 60–90 s. SAC0307 has a wider 10°C mushy zone than SAC305 — always profile to the 227°C liquidus, not the 217°C solidus. This profile is a starting reference; always validate on your own thermal-mass test board.
4
STORAGE
STORAGE TEMP
2–10°C
Refrigerate, do not freeze
SHELF LIFE
6 Months
From manufacture date
WARM-UP
≥ 4 h
Sealed, to room temp
5
TROUBLESHOOTING
Spattering or solder balls
Syringe was opened while still cold and moisture condensed inside. Always acclimate the sealed syringe to room temperature, and lengthen the soak stage to drive off volatiles.
Paste won't flow / dull, grainy joints
Peak temperature too low, time above 227°C too short, or paste past its EXP date. Raise the peak toward 250°C, extend TAL to 60–90 s, and use fresh paste.
Bridging between pads
Too much paste deposited. Use a finer needle (22G) or a thinner stencil deposit, and apply less pressure.
Poor wetting / de-wetting
Oxidized or contaminated pads. Clean with 99% IPA and let the board dry completely before applying paste.
Paste separates or looks watery
The syringe was warmed too fast or stored above 10°C. Do not force-warm; discard paste that has visibly separated.
6
HOW TO USE
1
Warm the syringe
Take the syringe from the refrigerator and let it reach room temperature (20–25°C) sealed, for at least 4 hours. Never microwave it, run it under hot water, or apply direct heat.
Open only when fully warmed — cold paste spatters2
Prepare the workspace
Work with source-capture fume extraction, or in a well-ventilated area. Wear nitrile gloves and safety glasses with side shields. Clean the PCB pads with 99% IPA and let them dry completely.
Keep your head out of the solder-fume plume3
Attach the dispensing needle
Screw a needle onto the luer-lock tip. Use 20G–22G. For pitches under 0.5 mm, use SAC305 Type 5 paste.
4
Apply paste to the pads
Press the plunger with even, gentle pressure and lay down only enough paste to cover each pad. Avoid overlapping onto adjacent pads.
Less is more — start small and add if needed5
Place the components
Place parts with tweezers or a vacuum pen. The tack of the paste (30–40 gf) holds components in position until reflow.
6
Reflow
Run the profile in Section 3: peak 240–250°C, 60–90 s above 227°C, until the paste fully collapses, wets and turns shiny. Stop heating and let the board cool at ≤ 4°C/s.
Look for full wetting and a bright, smooth fillet7
Inspect — no cleaning needed
Good joints are bright and fully wetted. The ROL0 no-clean, halide-free residue is non-conductive and non-corrosive and may be left on the assembly. If cosmetic cleaning is wanted, use a flux remover per its own SDS.
7
SAFETY INFORMATION
WARNING
Hazard statements — H317 May cause an allergic skin reaction (rosin / colophony).
Precautionary statements — P261 Avoid breathing dust or fumes. P264 Wash hands and exposed skin thoroughly after handling. P272 Contaminated work clothing must not be allowed out of the workplace. P280 Wear protective gloves, eye protection and protective clothing. P302+P352 IF ON SKIN: Wash with plenty of soap and water. P333+P313 If skin irritation or rash occurs: Get medical advice or attention. P362+P364 Take off contaminated clothing and wash it before reuse. P501 Dispose of contents and container in accordance with local, regional and national regulations.
KEEP OUT OF REACH OF CHILDREN.
DO NOT
✗ Swallow, or allow contact with eyes — rinse with water for at least 15 minutes.
✗ Discard with household waste — follow local hazardous-waste rules.
✗ Use near open flame, or heat the syringe directly.
FIRST AID — Skin: wash with soap and water. Eyes: rinse with water for 15 minutes. Inhaled: move to fresh air. Swallowed: rinse mouth, do NOT induce vomiting. If symptoms persist, get medical advice. Poison Control 1-800-222-1222 (USA).
STORAGE — Refrigerate 2–10 °C (36–50 °F). Do not freeze. Bring the sealed syringe to room temperature for at least 4 h before opening. Shelf life 6 months unopened; use within 3 weeks after opening.
For professional and hobbyist electronics assembly and repair. Not for human consumption or food-contact use. Transport classification: see SDS Section 14.
Full Safety Data Sheet
tinvoa.co/sds/sac0307
™SKU TSP-SAC0307-30G · DOC-IFU-SAC0307-30G-001-EN · Rev. B · Safety content per SDS LSK-SDS-SAC0307 v1.2 (2026-07-21)
www.tinvoa.co